Your specialist for hybrid, SMT, semiconductor and solar technology
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Stratus Vision GmbH - Solutions for AOI

 

 

 

 

ESI
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With corporate offices all over the world, ESI develops and delivers the enabling technology solutions that bring our customers' advanced manufacturing applications to life. Their leading brands include precision motion products, lasers, and laser systems, and are used to boost efficiency and productivity in the global medical, semiconductor, electronics, and industrial markets.

Hybrid Technologies

gsi_lt2100Circuit Trim LT2200 - Thick Film Laser Trim System

An advanced new platform ideal for trim and test of thick film components and circuits, including PCBs, SMT components, and hybrids.

  • Versatility to address our widest range of trim and micro-machining applications.
  • ully integrated test functions for fast and accurate measurement.
    Patented beam calibration and powerful vision system for precise, efficient beam positioning.
  • ersiTrim™ software for easy application programming and automation integration.
  • XI architecture with GPIB and other interfaces for custom instrumentation.
  • Advanced diode-pumped laser processing in IR or green wavelengths for demanding applications.

Circuit Trim LT2210 - Thin Film Laser Trim System

An advanced new platform ideal for trim and test of thin film resistors, resistor networks, and other thin film applications.
  • Versatility to address our widest range of thin film trimming and micro-machining applications.
  • Positioning accuracy and small spot sizes for ultra-fine geometries.
  • Patented beam calibration and powerful vision system for precise, efficient beam positioning.
  • Exclusive “Adaptive Trim Control” provides statistical information and intelligent recommendations to compensate for process variations.
  • Open-architecture VXI, GPIB and custom instrumentation supports passive and functional circuit adjustment.
  • Advanced diode-pumped laser processing in IR or green wavelengths for demanding applications.

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Semiconductor
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WaferTrim M350 - Active IC Trim System

An advanced new platform for high precision, high throughput wafer-level optimization of linear and mixed-signal IC devices.

  • Next generation version of out field-proven M310 WaferTrim technology.
  • Fully integrated state-of-the-art Laser Trimmer and Wafer Prober System.
  • Seamless integration to today's ATEs via GSI Group's Enchanced Tester Interface software and real-time tester interface hardware.
  • Proven superior laser control ensures process consistency & highest yields.
  • Advanced vision and motion subsystems provide dramatically improved positioning and alignment capability.
  • A new user friendly WaferTrim™ software improves efficiency and provides compatibility with existing M310 data setup file
 

 



For orders/more information about these or other GSI products, please contact:

Bryan Burton
Tel: +49-89-82 99 89-24
Fax: +49-89-82 99 89-99
E-mail: bburton@epp-germany.com